Fraunhofer Institute for Microstructure of Materials and Systems IMWSWe offer you comprehensive services in failure analysis and material characterization. Combined in one hand to save time and money, led by a committed, service-focused team with extensive knowledge of material-related issues in microelectronics. What’s more, the facilities offered are first rate — within the Fraunhofer Gesellschaft, Fraunhofer IMWS has an extensive range of equipment for microstructural diagnosis.
Technical equipment
Defect localization and non-destructive testing:
- Nanoprobing and electron beam-based current mapping (EBIC, EBAC)
- Emission microscopy
- Lock-in thermography
- Magnetic force microscopy
- Acoustic microscopy (SAM, GHz-SAM)
- 2D and 3D X-ray inspection
High-resolution material diagnostics and destructive testing:
- Decapsulation of components and precision cross-sectioning
- Rapid, high-performance chip and housing analysis with laser FIB and plasma FIB systems
- Optical/IR spectroscopy (UV/VIS/FTIR and Raman)
- High-resolution microstructure and interface analysis (combined FIB/SEM and SEM with X-ray analysis)
- Nanoanalytics (TEM/STEM microscopes (60–300 kV) with image correction, HAADF, EDS, EELS), AFM
- Surface- and trace-analysis (AFM, ToF-SIMS, XPS)
- Mechanical characterization (nanoindentation and material testing at increased temperatures)
- Thermomechanical deformation characterization (white light interferometry, laser triangulation, profilometry)
- Residual stress analysis
- Characterization of thermophysical properties
Modeling and simulation:
- Finite-Element-Analysis (software tools: mechanical, thermo-mechanical and multi-physical simulation, acoustic simulation, implementation of optimization tools)
- non-linear material behavior, microstructure-based analysis, fracture mechanics, material fatigue
- Numerical, design optimization, robustness analyses
- Numerical / experimental parameter identification for complex models
Mechanical/thermomechanical characterization:
- Mechanical characterization (various tensile / pressure / bending test setups up to 500 °C)
- Micromechanical characterization (design, generation and test of specific test structures, local characterization of bulk material, increased temperatures)
- Nanoindentation (temperature-dependent, material mapping, nano-DMA)
- Thermomechanical deformation analyses (white light interferometry, laser triangulation, profilometry)
- Fracture mechanical parameter identification (bulk material / material interfaces)
- Dynamic material characterization (cyclic tests, fatigue (LCF))
- Dynamic measurement of vibrations (Laser-Doppler-Vibrometry)
- Estimation of thermophysical material properties