Non-destructive defect localization

Whether new mobility, intelligent analysis production, or modern energy technology: reliable and robust electronics are the prerequisite for lasting success in the market in all these areas. The failure analysis of complex microelectronic components is of increasing importance for ensuring and improving reliability, quality, and production yield. Especially for complex and fully enclosed components, non-destructive testing methods are required to locate, for example, short circuits and interruptions in the internal circuits.

We support our partners:

• with the development and application-specific design of focused acoustic probes
• through the development of measurement technology and set-ups for acoustics and thermography
• with the software implementation for the hardware
• through the development of signal and data analysis methods including software

Our customers benefit from our comprehensive expertise in scanning acoustic microscopy (SAM) and lock-in thermography (LIT), high-frequency acoustic measurement technology and microscopic magnetic field measurement techniques. Our focus is on the needs of our clients and their involvement in the analysis process.

Based on extensive knowledge in hardware, software and method development, our team develops and researches new methods of machine learning and signal and data analysis. We are aware of the current industrial challenges facing our customers, focus on their needs and always cooperate with them in the analysis process.