Failure analysis and material diagnostics for microelectronics

In the Business Unit “Electronic Materials and Components” Fraunhofer IMWS analyzes components, systems and materials for electronics, such as integrated semiconductor circuits, sensors, and electronic components and assemblies. By means of comprehensive analyses and tests our goal is to understand the connection between technological production processes and operating conditions, the microstructural and material properties, as well as the functional properties which depend on these. To this end, we use complex, efficient methods, which include non-destructive analysis, high-resolution electron microscopy and solid-state spectroscopy methods, surface- and trace-analysis methods, as well as mechanical material characterization, modeling and numerical simulation.

Our work focuses on areas such as the microstructural process characterization during the introduction of innovative technologies, as well as rapid, customer-oriented identification failure modes and understanding of defect formations and degradation mechanisms. The results are incorporated into customers’ production processes, helping to increase the quality and reliability of the systems in their application.

Our customers and partners primarily come from the automotive electronics supply chain, but also from communications technology, the medical and consumer industry, power electronics for energy and industry technology, as well as material suppliers and tool suppliers for manufacturing, diagnostics and testing.