Automotive Packaging

In automotive packaging, semiconductor chips that are used in automotive applications are connected to their surroundings, encapsulated for protection and assembled on substrates to form electronic components, modules and complex 3D-integrated microsystems and subsystems. The designs, process steps and materials used in packaging have a significant impact on reliability. This behaviour plays a decisive role especially when difficult environmental conditions (humidity, heat, aggressive media) apply.

We support our partners in:

• complex material diagnostics and failure analysis in the field of packaging (both printed circuit boards (PCB) and lead frame-based, as well as ceramic-based assemblies) and the associated research into the underlying causes of defects and the prevention of failures
• test development and research into interaction mechanisms in the area of interconnection technology
• the optimization and development of preparation methods

Our customers benefit from:

• an increased reliability and robustness of their electronic systems
• improved cost efficiency as a result
• our support in implementing an improved risk management