Packaging and Assembly

Contact materials and interconnects (e.g. wire bond contacts, soldered, press-fit, adhesive connections) must meet high requirements for efficiency and reliability  as they are key points for the functionality of components and systems.

At the same time, mass production, integration density and cost pressure demand high-throughput and robust manufacturing processes, low material usage and cost-efficient composite materials. We support you with our know-how along the entire value chain.

We support our partners in:

• material development and selection (qualification, development- and production support)
• the creation of mission profile concepts (material and component design)
• fault and degradation analysis up to the identification of mechanisms as well as the definition of corrective measures
• the evaluation, adaptation, enhancement and new development of test and analysis methods and their evaluation criteria

With our comprehensive knowledge of material properties and behavior, we enable our partners to carry out effective development processes and support them in new developments by providing material and process expertise.

Our customers benefit from:

• a better understanding of the product
• increased reliability and robustness of their electronic systems
• a joint development of test and analysis methods that are adapted to the respective customer-specific questions
• our knowledge of influencing factors, interactions and degradation mechanisms and the repair thereof, should a damage event have occurred