Publications - Fraunhofer IMWS

2022

Jahr/Year	Titel/Autor Title/Author
2022	Quantitative Assessment of the Porosity in Ag-sintered Joints by non-destructive acoustic Inspection supplemented with a Deep Leaning assisted Signal Analysis Brand, Sebastian; Kögel, Michael; Altmann, Frank; Bach, Hoang Linh
2022	Accelerated Lifetime Testing and Failure Analysis for Advanced Automotive Grade Ceramic Capacitors (MLCC) Dresel, Fabian; Leib, Jürgen; Schletz, Andreas; Boettge, Bianca; Klengel, Sandy
2022	Comprehensive Study of Long-Term Reliability of Copper Bonding Wires at Harsh Automotive Conditions Klengel, Robert; Klengel, Sandy; Tismer, Sebastian; Ackermann, Thomas; Araki, N.; Eto, M.; Haibara, T.; Yamada, T.; Feldmann, J.; Binner, R.; Peters, H.; Scheer, A.; Chee, V.
2022	Quantitative Assessment of the Porosity in Ag-sintered Joints by non-destructive acoustic Inspection supplemented with a Deep Leaning assisted Signal Analysis Brand, Sebastian; Kögel, Michael; Altmann, Frank; Bach, Hoang Linh

2021

Jahr/Year	Titel/Autor Title/Author
2021	Deep Learning assisted quantitative Assessment of the Porosity in Ag-Sinter joints based on non-destructive acoustic inspection Brand, S.; Koegel, M.; Altmann, F.
2021	Improved AlScN/GaN heterostructures grown by metal-organic chemical vapor deposition Manz, Christian; Leone, Stefano; Kirste, Lutz; Ligl, Jana; Frei, Kathrin; Fuchs, Theodor; Prescher, Mario; Waltereit, Patrick; Verheijen, Marcel A.; Graff, Andreas; Simon-Najasek, Michél; Fiederle, Michael; Ambacher, Oliver
2021	Local metal segregation as root cause for electrical shorts in highly doped pressure sensor devices Simon-Najasek, M.; Diehle, P.; Große, C.; Hübner, S.; Brokmann, G.; Sprenger, B.; Altmann, F.
2021	Nano Security: From Nano-Electronics to Secure Systems Polian, I.; Altmann, F.; Arul, T.; Boit, C.; Brederlow, R.; Davi, L.; Drechsler, R.; Du, N.; Eisenbarth, T.; Güneysu, T.; Hermann, S.; Hiller, M.; Leupers, R.; Merchant, F.; Mussenbrock, T.; Katzenbeisser, S.; Kumar, A.; Kunz, W.; Mikolajick, T.; Pachauri, V.; Seifert, J.-P.; Sill Torres, F.; Trommer, J.
2021	Nano-CT imaging of electrically stressed power device metallization Mueller, D.; Fella, C.; Altmann, F.; Graetz, J.; Balles, A.; Ring, M.; Gambino, J.
2021	Reliability and failure analysis of 100 nm AlGaN/GaN HEMTs under DC and RF Stress Dammann, Michael; Baeumler, Martina; Kemmer, Tobias; Konstanzer, Helmer; Brueckner, Peter; Krause, Sebastian; Graff, Andreas; Simon-Najasek, Michél
2021	Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR) Koegel, M.; Brand, S.; Große, C.; Jacobs, K.J.P.; Wolf, I. de; Altmann, F.

2020

Jahr/Year	Titel/Autor Title/Author
2020	3D hot-spot localization by lock-in thermography Brand, S.; Altmann, F.
2020	Accelerated Lifetime Testing and Failure Analysis for Advanced Automotive Grade Ceramic Capacitors (MLCC) Dresel, Fabian; Leib, Jürgen; Schletz, Andreas; Boettge, Bianca; Klengel, Sandy
2020	Dielectric strength and aging performance of polybutylene terephthalate (PBT) under the influence of temperature and humidity Wels, S.; Boettge, B.; Bernhardt, R.; Klengel, S.; Claudi, A.
2020	Effects of alloying elements in high reliability copper wire bond material for high temperature applications Eto, M.; Araki, N.; Yamada, T.; Klengel, R.; Klengel, S.; Petzold, M.; Sugiyama, M.; Fujimoto, S.
2020	Enhanced non-contact ultrasonic testing using an air-coupled optical microphone Kaniak, G.; Rohringer, W.; Brauns, M.; Panzer, N.; Lücking, F.; Fischer, B.; Brand, S.; Große, C.
2020	How copper wire material additive elements effect the reliability of wire bonded contacts in HAST testing Klengel, R.; Klengel, S.; Petzold, M.; Eto, M.; Araki, N.; Yamada, T.
2020	Influence of Copper Wire Material Additive Elements to the Reliability of Wire Bonded Contacts Klengel, R.; Klengel, S.; Schischka, J.; Stephan, T.; Petzold, M.; Eto, M.; Araki, N.; Yamada, T.
2020	Mechanical and microstructural characterization of LTCC and HTCC ceramics for high temperature and harsh environment application Naumann, Falk; Lorenz, Georg; Bernasch, Michael; Boettge, Bianca; Schischka, Jan; Ziesche, Steffen; Pernau, Hans-Fridtjof; Jägle, M.; Klengel, Sandy; Kappert, Holger
2020	Microstructure and shear force correlation after reliability testing of bond contacts using alternative al heavy wire materials Klengel, R.; Groth, A.; Hempel, M.; Schischka, J.; Stephan, T.; Klengel, S.; Schneider-Ramelow, M.
2020	Numerical material design for reliable power electronics with cement-based encapsulation Naumann, F.; Boettge, B.; Behrendt, S.; Eisele, R.; Klengel, S.
2020	On-Wafer Fast Evaluation of Failure Mechanism of 0.25-mm AlGaN/GaN HEMTs: Evidence of Sidewall Indiffusion Rzin, M.; Meneghini, M.; Rampazzo, F.; Zhan, V.G.; Marcon, D.; Grünenpütt, J.; Jung, H.; Lambert, B.; Riepe, K.; Blanck, H.; Graff, A.; Altmann, F.; Simon-Najasek, M.; Poppitz, D.; Meneghesso, G.; Zanoni, E.
2020	Reliability Physics of GaN HEMT Microwave Devices: The Age of Scaling Zanoni, E.; Meneghini, M.; Meneghesso, G.; Rampazzo, F.; Marcon, D.; Zhan, V.G.; Chiocchetta, F.; Graff, A.; Altmann, F.; Simon-Najasek, M.; Poppitz, D.
2020	Root cause analysis of gate shorts in semi-vertical GaN MOSFET devices Diehle, P.; Hübner, S.; Santi, C. de; Mukherjee, K.; Zanoni, E.; Meneghini, M.; Geens, K.; You, S.; Decoutere, S.; Altmann, F.

2019

Jahr/Year	Titel/Autor Title/Author
2019	Adaptive low-temperature covalent bonding of III-nitride thin films by extremely thin water interlayers Gerrer, Thomas; Graff, Andreas; Simon-Najasek, Michél; Czap, Heiko; Maier, Thomas; Benkhelifa, Fouad; Müller, Stefan; Nebel, Christoph E.; Waltereit, Patrick; Quay, Rüdiger; Cimalla, Volker
2019	Au-Pd@Meso-Co3O4: A Promising Material for New Generation Pellistor with Low Working Temperature Lyu, Xuemeng; Gao, Haitao; Diehle, Patrick; Altmann, Frank; Tarantik, Karina; Schmitt, Katrin; Wöllenstein, Jürgen
2019	Influence of copper wire material to corrosion resistant packages and systems for high temperature applications Klengel, S.; Klengel, R.; Schischka, J.; Stephan, T.; Petzold, M.; Eto, M.; Araki, N.; Yamada, T.
2019	Investigation of mechanical and microstructural properties of a new, corrosion resistant gold-palladium coated copper bond wire Lorenz, G.; Naumann, F.; Klengel, R.; Klengel, S.; Petzold, M.; Eto, M.; Araki, N.; Yamada, T.
2019	Micro-Transfer-Printing and Potential Process Optimizations by FEA Bühler, K.; Lorenz, G.; Mittag, M.; Krieger, U.; Heise, N.; Wicht, S.; Gerbach, R.; Naumann, F.
2019	Micro-transfer-printing for heterogeneous integration Corbett, B.; Li, Z.; Bühler, K.; Naumann, F.; Krieger, U.; Wicht, S.; Bower, C.A.
2019	New Access to Soft Breakdown Parameters of Low-k Dielectrics Through Localisation-Based Analysis Herfurth, N.; Beyreuther, A.; Amini, E.; Boit, C.; Simon-Najasek, M.; Hubner, S.; Altmann, F.; Herfurth, R.; Wu, C.; De Wolf, I.; Croes, K.
2019	Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation Herfurth, N.; Wu, C.; Beyreuther, A.; Nakamura, T.; Wolf, I. de; Simon-Najasek, M.; Altmann, F.; Croes, K.; Boit, C.
2019	SAM3: New failure analysis methods for heterogeneous systems Schweinböck, T.; Pressel, K.; Altmann, F.; Hoffrogge, P.; Grimm, M.; Keiper, B.
2019	Utilization of scanning acoustic microscopy (SAM) in quantifying the biomechanical variations in tissues with Fuchs endothelial dystrophy (FECD) Perone, J.M.; Mohamed, E.T.A.; Brand, S.; Koegel, M.; Declercq, N.F.

2018

Jahr/Year	Titel/Autor Title/Author
2018	A new method for prediction of corrosion processes in Aluminum housing materials for electronic components Klengel, S.; Stephan, T.; Mühs-Portius, B.
2018	A New, Efficient Method for Preparation of 3D Integrated Systems by Laser Techniques Klengel, R.; Klengel, S.; Schusser, G.; Krause, M.
2018	Comparison of reliability of 100 nm AlGaN/GaN HEMTs with T-gate and SAG-gate technology Dammann, Michael; Baeumler, Martina; Brueckner, Peter; Kemmer, Tobias; Konstanzer, Helmer; Graff, Andreas; Simon-Najasek, Michél; Quay, Rüdiger
2018	Corrosion mechanism in metallization systems for printed circuit boards Klengel, S.; Stephan, T.; Mühs-Portius, B.;Klengel, R.
2018	Defect analysis using scanning acoustic microscopy for bonded microelectronic components with extended resolution and defect sensitivity Brand, S.; Vogg, G.; Petzold, M.
2018	Failure Analysis Techniques for 3D Packages Altmann, F.; Brand, S.; Petzold, M.
2018	Fast and Distributed Thermal Model for Thermal Modeling of GaN Power Devices Sodan, V.; Stoffels, S.; Oprins, H.; Decoutere, S.; Altmann, F.; Baelmans, M.; De Wolf, I.
2018	Finite element study of chip package induced mechanical and corrosive failure modes complementing microstructural root cause analyses Lorenz, G.; Simon-Najasek, M.; Lindner, A.
2018	High resolution acoustic GHz microscopy Brand, S.; Kögel, M.; Altmann, F.
2018	Investigation of Material Dynamic Processes During Shear Test of Aluminum Heavy Wire Bond Contacts Klengel, R.; Naumann, F.; Tismer, S.; Klengel, S.
2018	Limitation of test sample arrangements according to IEC 60243-1: Electrical strength of insulating materials - Test methods Wels, S.; Obst, J.; Claudi, A.; Böttge, B.; Bernhardt, R.; Klengel, S.
2018	Lock-In-Thermography, Photoemission, and Time-Resolved GHz Acoustic Microscopy Techniques for Nondestructive Defect Localization in TSV Brand, S.; Altmann, F.
2018	Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density Böttge, B.; Naumann, F.; Behrendt, S.; Scheibel, M.G.; Kässner, S.; Klengel, S.; Petzold, M.; Nickel, K.G.; Hejtmann, G.; Miric, A.-Z.; Eisele, R.
2018	Microstructural and chemical investigation of dielectric breakdown areas in engineering plastics Bernhardt, R.; Böttge, B.; Klengel, S.; Bron, M.; Bron, M.; Wels, S.; Claudi, A.
2018	Non-destructive Assessment of the Porosity in Silver (Ag) Sinter Joints Using Acoustic Waves Brand, S.; Böttge, B.; Kögel, M.; Naumann, F.; Zijl, J.; Kersjes, S.; Behrens, T.; Altmann, F.
2018	Physical failure analysis methods for wide band gap semiconductor devices Graff, A.; Simon-Najasek, M.; Poppitz, D.; Altmann, F.
2018	Scanning Acoustic Microscopy Comparison of Descemet's Membrane Normal Tissue and Tissue With Fuchs' Endothelial Dystrophy Mohamed, E.T.A.; Perone, J.-M.; Brand, S.; Koegel, M.; Declercq, N.F.
2018	The influence of environmental conditions on the properties of housing materials for power electronics Böttge, B.; Bernhardt, R.; Klengel, S.; Wels, S.; Claudi, A.

2017

Jahr/Year	Titel/Autor Title/Author
2017	3D Localization of liner breakdown's within Cu filled TSV's by backside LIT and PEM defocusing series Altmann, F.; Grosse, C.; Wolf, I. de; Brand, S.
2017	A new method for prediction of corrosion processes in metallization systems for substrates and electrical contacts Klengel, S.; Stpehan, T.; Spohn, U.
2017	Acoustic and photoacoustic inspection of through-silicon vias in the GHz-frequency band Brand, S.; Kögel, M.; Khaled, A.; DeWolf, I.; Moore, M.J.; Strohm, E.M.; Kolios, M.C.; Altmann, F.
2017	Exploring the thermal limit of GaN power devices under extreme overload conditions Pribahsnik, F.P.; Nelhiebel, M.; Mataln, M.; Bernardoni, M.; Prechtl, G.; Altmann, F.; Poppitz, D.; Lindemann, A.
2017	Gigahertz scanning acoustic microscopy analysis of voids in Cu-Sn micro-connects Ross, G.; Vuorinen, V.; Petzold, M.; Paulasto-Kröckel, M.; Brand, S.
2017	High resolution physical analysis of ohmic contact formation at GaN-HEMT devices Graff, A.; Simon-Najasek, M.; Altmann, F.; Kuzmik, J.; Gregusová, D.; Hascík, S.; Jung, H.; Baur, T.; Grünenpütt, J.; Blanck, H.
2017	Interfacial void segregation of Cl in Cu-Sn micro-connects Ross, G.; Tao, X.; Broas, M.; Mäntyoja, N.; Vuorinen, V.; Graff, A.; Altmann, F.; Petzold, M.; Paulasto-Kröckel, M.
2017	On reproducing the copper extrusion of through-silicon-vias from the atomic scale Liu, J.; Huang, Z.; Conway, P.P.; Altmann, F.; Petzold, M.; Naumann, F.
2017	Reliability of 100 nm AlGaN/GaN HEMTs for mm-wave applications Dammann, Michael; Baeumler, Martina; Polyakov, Vladimir M.; Brueckner, Peter; Konstanzer, Helmer; Quay, Rüdiger; Mikulla, Michael; Graff, Andreas; Simon-Najasek, M.
2017	Study of GHz-SAM sensitivity to delamination in BEOL layers Khaled, A.; Kljucar, L.; Brand, S.; Kögel, M.; Aertgeerts, R.; Nicasy, R.; De Wolf, I.
2017	The combined effect of mechanical package stress and humidity on chip corrosion probability Lorenz, G.; Simon-Najasek, M.; Lindner, A.
2017	XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects Ross, G.; Vuorinen, V.; Krause, M.; Reissaus, S.; Petzold, M.; Paulasto-Kröckel, M.

2016

Jahr/Year	Titel/Autor Title/Author
2016	Advanced 3D failure characterization in multi-layered PCBs Grünwald, E.; Hammer, R.; Rosc, J.; Maier, G.A.; Bärnthaler, M.; Cordill M.J.; Brand, S.; Nuster, R.; Krivec, T.; Brunner, R.
2016	Comparative Reliability Study of Au Wire Bond Contacts on Al Metallization vs. over Pad Metallization Klengel, R.; Schischka, J.; Berthold, L.; Klengel, S.
2016	Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures Broas, M.; Graff, A.; Simon-Najasek, M.; Poppitz, D.; Altmann, F.; Jung, H.; Blanck, H.
2016	Correlation of PVD deposition parameters with electrical and mechanical properties of coated thin-glass compounds Lorenz, G.; Naumann, F.; Westphalen, J.; Weller, S.; Junghähnel, M.;
2016	Detection and analysis of stress-induced voiding in Al-power lines by acoustic GHz-microscopy Brand, S.; Simon-Najasek, M.; Kögel, M.; Jatzkowski, J.; Portius, R.; Altmann, F.;
2016	Fracture toughness of ultrashort pulse-bonded fused silica Richter, S.; Naumann, F.; Zimmermann, F.; Tünnermann, A.; Nolte, S.;
2016	Evaluation of the bond quality of laser-joined sapphire wafers using a fresnoite-glass sealant Pablos-Martin, A. de; Tismer, S.; Naumann, F.; Krause, M.; Lorenz, M.; Grundmann, M.; Höche, T.
2016	Failure analysis and material characterization in power electronics packaging Boettge, B.; Schak, M.; Klengel, R.; Schischka, J.; Klengel, S.
2016	HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
2016	Innovative failure analysis techniques for 3-D packaging developments Altmann, F.; Petzold, M.
2016	Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis Khaled, A.; Brand, S.; Kögel, M.; Appenroth, T.; De Wolf, I.
2016	Magnetic field and current density imaging using off-line lock-in analysis Kögel, M.; Altmann, F.; Tismer, S.; Brand, S.
2016	Microstructure and thermophysical characterization of innovative plastic materials for power electronics Klengel, S.; Böttge, B.; Naumann, F.; Mittag, M.; Hirsch, U.; Ehrich, C.
2016	Non-destructive assessment of reliability and quality related properties of power electronic devices for the in-line application of scanning acoustic microscopy Brand, S.; Naumann, F.; Tismer, S.; Böttge, B.; Rudzki, J.; Osterwald, F.; Petzold, M.
2016	Novel failure mode of chip corrosion at automotive HALL sensor devices under multiple stress conditions Simon-Najasek, M.; Lorenz, G.; Lindner, A.; Altmann, F.
2016	Numerical prototyping and defect evaluation of scanning acoustic microscopy for advanced failure diagnostics Naumann, F.; Brand, S.
2016	Potential failure risks causing delamination of sinter joints Boettge, B; Reissaus, S.; Klengel, S.
2016	Probabilistic strength characterization of thin semiconductor devices for power electronic applications Naumann, F.; Mittag, M.; Bernasch, M.; Petzold, M.
2016	Reliability evaluation of Si-dies due to assembly issues Naumann, F.; Gottschalk, V.; Burchard, B.; Altmann, F.

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