The workshop focuses on how to detect, control and avoid defects and thus further improve the quality and reliability of semiconductor components and systems. The trend towards ever smaller components and parts and increasing complexity, for example in the field of heterointegration, requires further consistent development of failure analysis methods. An exhibition of analytical equipment by international diagnostics manufacturers forms part of the workshop.

"Localizing and analyzing electrical failures and defects in modern highly complex semiconductor devices, requires high-resolution and efficient diagnostic methods. Furthermore, material degradation must be better understood in order to ensure the functionality of devices over their specified lifetime. At our workshop, which is now in its tenth year, international industry failure analysis experts will discuss new approaches to solving these questions," says Frank Altmann, Head of the "Materials and Components for Electronics" business unit and organizer of the workshop.

This year, new challenges and approaches in the field of 3D heterointegration, with keynotes by Dr. Gaurang Choksi from Intel, USA, and Anne Jourdain from the leading international research institute IMEC in Belgium, will be one of the key aspects we focus on in our workshop. Furthermore, we will discuss new trends and failure analysis issues in automotive electronics. Andreas Aal, Volkswagen AG, will address the topic of the safety of control units (ECUs) in his keynote speech. Finally, we will focus on the increasingly important topics in the field of hardware safety and counterfeit detection. In his keynote, Prof. Navid Asadi of the University of Florida, USA, will give an overview of the corresponding analysis methods combined with machine learning.

The technical contributions will be complemented with a session on the status of the failure analysis technology roadmap, which is driven forward by the international failure analysis organization EDFAS. Leading experts from the semiconductor industry will present and discuss new trends and analytics challenges in the field of chip and packaging technologies.

The CAM Workshop has become an internationally renowned meeting place for failure analysis experts from the electronics industry. Every year it gives new impetus to the long-term orientation of quality, robustness and reliability research. Registration for the workshop on April 25 and 26 is still possible via the website until April 14, 2023.