Micromechanical testing and simulation

Understanding the complex material and degradation behavior is important for the development process

Renewable energies, electromobility or automated industrial technology pose new challenges for electronic components as they place increasing demands on reliability and operate under more difficult conditions. The right choice of material as well as its characteristics regarding material and fatigue behavior play an essential role in this context.

For this assessment, relevant and load-related material properties must be identified to enable reliable component design. To this end, process- and application-related operating simulations of critical components are included in the development process to better understand potential failure modes.

Increased simulation accuracy through adapted material models

© Fraunhofer IMWS
FEA analysis of stress on semiconductors during wire bonding

Our customers benefit from improved thermomechanical reliability and robustness assessment of their electronic systems, as well as accelerated product development and increased cost efficiency. Our work enables better predictions of component behavior in simulation as well as a more comprehensive understanding of material behavior under critical stress conditions.

What you can expect: Services for the specific material evaluation of materials for electronic applications

We support our partners in:

  • the thermomechanical material characterization of materials for microelectronics and power electronics
  • the parameter identification for extended material models using finite element method
  • parameter identification for failure models/ damage hypotheses
  • sub-modelling of specific failure modes (e.g. material fatigue, fracture mechanics)
  • the comparison of FEM simulation with information from high-resolution failure diagnostics
  • the identification of potential failure mechanisms and the development of lifetime prediction concepts

Your benefit: our longstanding experience

We offer our customers individually adapted solutions for micromechanical material characterization under real-load operating conditions. For this purpose, we combine experimental methods of macro- and micromechanical material characterization with numerical simulation approaches as well as techniques of high-resolution defect localization and defect analysis. This enables an improved understanding of the material interaction under operating conditions as well as the development of degradation mechanisms. Together with our customers, we develop adapted test procedures and support them in simulation approaches to map physically based failure modes.

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      Services offered

       

      Simulation and modelling

       

      Test development for material characterization

       

      Material characterization

       

      Determination of characteristic data for failure and degradation models

      Publications

      Year Title/Author
      2022

      Flyer: Micromechanical testing and simulation

      2020

      Mechanical and microstructural characterization of LTCC and HTCC ceramics for high temperature and harsh environment application

      Naumann, Falk; Lorenz, Georg; Bernasch, Michael; Boettge, Bianca; Schischka, Jan; Ziesche, Steffen; Pernau, Hans-Fridtjof; Jägle, M.; Klengel, Sandy; Kappert, Holger
      2020

      Numerical material design for reliable power electronics with cement-based encapsulation

      Naumann, F.; Boettge, B.; Behrendt, S.; Eisele, R.; Klengel, S.
      2019

      Micro-Transfer-Printing and Potential Process Optimizations by FEA

      Bühler, K.; Lorenz, G.; Mittag, M.; Krieger, U.; Heise, N.; Wicht, S.; Gerbach, R.; Naumann, F.
      2016

      Reliability evaluation of Si-dies due to assembly issues

      Naumann, F.; Gottschalk, V.; Burchard, B.; Altmann, F.
      2013

      Fracture mechanics life-time modeling of low temperature Si fusion bonded interfaces used for 3D MEMS device integration

      Naumann, F.; Bernasch, M.; Siegert, J.; Carniello, S.; Petzold, M.