The black pad effect refers to the corrosion of Nickel in, for example: Cu/Ni/Au. Metallization of the PCB leads to black surfaces that cannot be soldered.
The black pad effect refers to the corrosion of Nickel in, for example: Cu/Ni/Au. Metallization of the PCB leads to black surfaces that cannot be soldered.
Formation of characteristic structures due to electrochemical migration processes.
The movement of dissolved ions in an electrical field from the anode to the cathode and the formation of dendrites, which usually causes short circuits.
Measurement method for the electrochemical characterization of surfaces by applying a static voltage and measuring the resulting corrosion current.
Standardized test for evaluating the effectiveness of corrosion protection on surfaces and coatings based on NaCl electrolytes.
Standardized test with mixed gases (NO2, SO2, Cl2, H2S) for the evaluation of the corrosion behavior of metallic surfaces.
Measurement method for the electrochemical characterization of surfaces (DIN 50918) by applying a cyclical voltage and measuring the resulting corrosion current.