Fraunhofer Institute for Microstructure of Materials and Systems IMWSThe scientists at the Fraunhofer IMWS publish about 100 articles in technical journals, books, or at renowned conferences. You will find an overview of publications on the topic of corrosion in microelectronics here.
- S.Klengel. et al. „A new method for prediction of corrosion processes in metallization systems for substrates and electrical contacts.“ IEEE 67th Electronic Components and Technology Conference (ECTC). IEEE 2017
- S.Klengel et al., „A new method for prediction of corrosion processes in Aluminum housing materials for electronic components“, EMPC 2017
- S.Klengel et.al., “Corrosion mechanism in metallization systems for printed circuit boards” ESTC 2018
- Klengel, Robert, et al. „Novel investigation of influencing factors for corrosive interface degradation in wire bond contacts.“ European Microelectronics Packaging Conference (EMPC). IEEE 2013
- Klengel, Sandy, et al. „A new reliable, corrosion resistant gold-palladium coated copper wire material.“ 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). IEEE,2019
- Klengel, Sandy, et al. „Influence of copper wire material to corrosion resistant packages and systems for high temperature applications“ European Microelectronics Packaging Conference (EMPC). Pisa, Italy, IMAPS 2019