Highlights

For the benefit of our costumers, we master complex, powerful methods that include non-destructive analytics, high-resolution methods of electron microscopy and solid-state spectroscopy, surface and trace analysis methods, and mechanical material characterization that includes modeling and numerical simulation. Here you can find a selection of our current projects.

 

22.10.2024

Improved methodology for predicting the reliability of PV and battery inverters

In the “Reliability Design” project, the Fraunhofer Institute for Microstructure of Materials and Systems IMWS has supported the development of more precise methods for lifetime predictions.

 

Sebastian Brand and Michael Kögel honored with Outstanding Researcher Award from Intel

For their work on increasing the sensitivity and 3D resolution of microscopic lock-in thermography analysis, the two scientists Dr. Sebastian Brand and Michael Kögel from the Fraunhofer Institute for Microstructure of Materials and Systems IMWS in Halle (Saale) have received one of the "Outstanding Researchers Award 2023" from Intel Corporation.

 

Elektronik / 7.12.2023

Sebastian Brand awarded "Attendees Best Paper" at the ISTFA 2023

The use of machine learning can improve signal processing. Dr Sebastian Brand presented findings and application examples of these possibilities at the 49th International Symposium for Testing and Failure Analysis (ISTFA) in Phoenix, USA.

 

20.3.2023

Novel method for characterizing nanometer-sized defects in GaN semiconductors

The Fraunhofer IMWS along with 79 partners from 14 countries have joined forces in the EU-funded project "iRel 4.0" (Intelligent Reliability 4.0) to find solutions to improve the reliability of electronic components and systems along the entire value chain.

 

20.3.2023

Experts discuss new trends and approaches in microelectronics

At this year's tenth CAM workshop international experts from the electronics industry and analytical equipment manufacturers will discuss technological challenges, new approaches and future requirements in failure analysis and material characterization of electronic components and systems.

 

1.2.2023

Power semiconductors made of gallium nitride

In the EU-funded project "UltimateGaN", 26 partners from nine European countries conducted joint research on the next generation of gallium nitride (GaN)-based power semiconductors.

 

Mechanical characterization of electronic materials with respect to high temperature application and physics of failure

Online Expert Session 2020/21 with Falk Naumann