Fraunhofer Institute for Microstructure of Materials and Systems IMWSMechanical characterization of electronic materials with respect to high temperature application and physics of failure
Event details
Program
Due to increasing reliability requirements for micro- and power-electronic devices, a deeper understanding of material specific degradation mechanisms is one of the key factors for reliable product design, customized reliability testing, as well as specific adapted failure analysis strategies. Especially for numerical based reliability assessment by Finite Element Analysis (FEA), the selected material properties, the choice of appropriate material models and data for damage models has great impact to the accuracy of generated results.
Within this session, physics of failure relevant characterization approaches – available at Fraunhofer IMWS – will be demonstrated and discussed with special focus on micromechanical material characterization for high temperature applications. In detail, mechanical test capabilities and local nano-indentation methods allowing characterization and parameter identification for FEA up to 500°C will be described. Furthermore, these results will be correlated with information from high resolution failure analysis, allowing a deeper understanding of potential degradation mechanisms or related failure modes.
Registration
Please register here: Materials Insights 20 | 21 - Registration - Fraunhofer IMWS
Location
MS Teams
Date
November 09, 2021, 14:00-14:45
Language
English