Fraunhofer Institute for Microstructure of Materials and Systems IMWSProfiles
Team Leader Non-destructive Diagnostics, Group Diagnostics Semiconductor Technologies
Areas of research:
- Acoustic Microscopy
- Lock-in thermography
- Signal analysis including AI-based methods
- Hardware development
- Software development
Academic/professional resume
since 2009 - present
Scientist and Research Team leader at the Fraunhofer IMWS, Halle, Germany
2007 - 2009
Project Manager at SFK-Technologies GmbH, Germany
2006 - 2009
Research Scientist/ Post-Doc ate Martin-Luther-University of Halle-Wittenberg, Germany
2004 - 2006
Postdoctoral Fellow at Ryerson Universitiy and the Ontario Cancer Institute of the UofT, Toronto, Canada
2000 - 2003
PhD Student and scientific assistant at Institute of Biomedical Physics of the Martin-Luther University Halle-Wittenberg
Education
2004
PhD in Electrical Engineering from the Otto-von-Guericke-University Magdeburg, Germany
2000
Diploma in Electrical Engineering from the Technical University of Ilmenau, Germany
Awards
2018
Best interactive presentation paper award at the Electronic Components and Technology Conference 2018
Publications
2022
Defect Localization by Lock-In-Thermography
S. Brand
2022
Machine learning reinforced acoustic signal analysis for enhancing non-destructive defect localization and reliable identification
S Brand, M Kögel, F Altmann, C Hollerith, P Gounet
2022
Machine Learning Based Data and Signal Analysis Methods for Application in Failure Analysis (2022 Update)
M Kögel, S Brand, F Altmann
2022
Quantitative Assessment of the Porosity in Ag-sintered Joints by non-destructive acoustic Inspection supplemented with a Deep Leaning assisted Signal Analysis
S Brand, M Koegel, F Altmann, L Bach
2022
Vertrauenswürdigkeit sicherheitskritischer elektronischer Komponenten in einer global verflochtenen Liefer-und Wertschöpfungskette
D Koster, U Netzelmann, S Quirin, J Oswald, C Jungmann, R Rick, ...
2022
Analysis of Time-Resolved Thermal Responses in Lock-In Thermography by Independent Component Analysis (ICA) for a 3D Spatial Separation of Weak Thermal Sources and Defects
M Kögel, S Brand, C Große, F Altmann, KJP Jacobs, I De Wolf
2021
Machine Learning Based Data and Signal Analysis Methods for Application in Failure Analysis
M Kögel, S Brand, F Altmann
2021
Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR)
M Koegel, S Brand, C Große, KJP Jacobs, I De Wolf, F Altmann
2021
Deep Learning assisted quantitative Assessment of the Porosity in Ag-Sinter joints based on non-destructive acoustic inspection
S Brand, M Koegel, F Altmann, L Bach
2021
Thermal source separation for 3D localization using independent component analysis (ICA) from time-resolved temperature response (TRTR)
M Kogel, S Brand, KJP Jacobs, I De Wolf, F Altmann
2021
Enhanced non-contact ultrasonic testing using an air-coupled optical microphone
G Kaniak, W Rohringer, M Brauns, N Panzer, F Lücking, B Fischer, ...
2020
Advanced 3D localization in Lock-In Thermography based on the analysis of the TRTR (Time-Resolved Thermal Response) received upon arbitrary waveform stimulation
S Brand, M Kögel, C Grosse, F Altmann, B Lai, Q Wang, J Vickers, D Tien, ...
2019
Machine learning assisted signal analysis in Acoustic Microscopy for non-destructive defect identification
M Kögel, S Brand, F Altmann
2019
GHz-Scanning Acoustic Microscopy Combined with ToF-SIMS/AFM for Wafer-Level Failure Analysis of Bonding Interfaces
I De Wolf, A Khaled, A Franquet, V Spampinato, T Conard, S Brand, ...
2019
Acoustic Microscopy of Semiconductor Packages
CD Hartfield, TM Moore, S Brand
2019
3D Hot-Spot Localization by Lock-in Thermography
S Brand, F Altmann
2019
Utilization of scanning acoustic microscopy (SAM) in quantifying the biomechanical variations in tissues with Fuchs endothelial dystrophy (FECD)
JM Perone, ETA Mohamed, M Koegel, NF Declercq
2019
An alternative application of ToF-SIMS/in-situ AFM: controlled sample preparation for IC failure analysis
A Franquet, V Spampinato, A Khaled, T Conard, S Brand, M Kogel, ...
2019
Non-destructive visualization of bond pad defects using acoustic microscopy in the GHz-band
S Brand, M Kögel, F Altmann, S Oberhoff, M Wiedenmann, J Krinke, ...
2018
High Resolution Acoustic GHz Microscopy
S Brand, M Kögel, F Altmann