Fraunhofer Institute for Microstructure of Materials and Systems IMWSProfile
Prof. Dr. rer. nat. Matthias Petzold, senior expert
Research activities
- Development of diagnostic and test methods for microcomponents
- Strength and reliability of Si microsystems
- Material evaluation for microelectronic components
- Mechanisms of action of dental care products
Academic/professional resume
Since 2019
Acting Director, Fraunhofer IMWS
2010 - 2019
Deputy Director, Fraunhofer IMWS
2008 - 2019
Head of Business Unit »Materials and Components of Electronics«, Fraunhofer IMWS
Since 2007
Honorary professor for microsystems technology at Merseburg University of Applied Sciences
2003 - 2018
Deputy Director of the Halle branch of Fraunhofer IWM/IMWS and Head of Business Unit »Materials and Components of Electronics«, Fraunhofer IMWS
1999 - 2008
Head of the research group »Diagnostics and assessment of micro systems«, Halle branch of Fraunhofer IWM (predecessor institution of Fraunhofer IMWS)
1992 - 1999
Research associate, Fraunhofer IWM (predecessor institution of Fraunhofer IMWS)
1989 – 1991
Permanent assistant Professor, Martin-Luther-University Halle-Wittenberg, Physics department
1987
PhD in solid state physics, received from Martin-Luther-University Halle-Wittenberg Halle. PhD Thesis on residual stress formation and measurement in glassy material surfaces
1986 – 1988
Research and Development department, Hermsdorf Ceramics Company
1980 – 1986
Temporary assistant Professor and scientific aspirant at the Martin-Luther-University Halle-Wittenberg, Department of Physics
1975 – 1980
Study of physics, Martin-Luther-University Halle-Wittenberg Halle. Diploma Thesis on Strength properties of ion-exchanged glasses
Awards
2019
Best Session Paper at Electronic Components Technology Conference (ECTC) for contribution to the material characterization of advanced cement-based potting systems for efficient power electronics with increased power density, jointly with Bianca Böttge, Falk Naumann and Sandy Klengel
2019
Lifetime Achievement Award at Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration
2018
EUREKA Innovation Award in »Large cooperation SME collaboration« category für research project MASTER_3D, on behalf of Fraunhofer IMWS jointly with Frank Altmann and Sebastian Brand
2018
Best Poster Award at 25th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits for contribution to available and newly developed failure analysis techniques suitable for 3D packaged devices, jointly with Frank Altmann and Sebastian Brand
2013
ENIAC Innovation Award des European Nanoelectronics Forums for »European research project ESiP (EfficientSiliconMulti-Chip System-in-Package Integration)«, jointly with Frank Altmann
2012
Outstanding Paper at 37th International Symposium for Testing and Failure Analysis for »Characterization and failure analysis of TSV interconnects: From non-destructive defect localization to material analysis with nanometer resolution«, jointly with Frank Altmann, Michael Krause and Christian Schmid
2012
Best Session Paper Award at Electronic Components and Technology Conference ECTC for »Characterization and failure analysis of TSV interconnects: From non-destructive defect localization to material analysis with nanometer resolution«, jointly with Frank Altmann, Michael Krause and Christian Schmidt
2009
Second Price for Best Poster at Micromechanics Europe Workshop for »Characterization of reactive nano scale multilayer foils for microsystem applications«, jointly with Bianca Böttge, Nico Teuscher, Jan Schischka, Michael Krause, Susanne Richter, Andreas Heilmann and Jörg Bagdahn
2009
Best Paper Award of Session at International Symposium on Microelectronics of the International Microelectronics Assembly and Packaging Society (IMAPS) for »Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire«, jointly with Robert Klengel, R. Dohle, H. Schulze and F. Rudolf