Matthias Petzold

Research activities

• Development of diagnostic and test methods for microcomponents
• Strength and reliability of Si microsystems
• Material evaluation for microelectronic components
• Mechanisms of action of dental care products

Academic/professional resume

Since 10/2019

Acting Director, Fraunhofer IMWS

10/2010 - 09/2019

Deputy Director, Fraunhofer IMWS

01/2008 - 09/2019

Head of Business Unit »Materials and Components of Electronics«, Fraunhofer IMWS

Since 01/2007

Honorary professor for microsystems technology at Merseburg University of Applied Sciences

09/2003 - 10/2018

Deputy Director of the Halle branch of Fraunhofer IWM/IMWS and Head of Business Unit »Materials and Components of Electronics«, Fraunhofer IMWS

01/1999 - 01/2008

Head of the research group »Diagnostics and assessment of micro systems«, Halle branch of Fraunhofer IWM (predecessor institution of Fraunhofer IMWS)

01/1992 - 01/1999

Research associate, Fraunhofer IWM (predecessor institution of Fraunhofer IMWS)

01/1989 – 12/1991

Permanent assistant Professor, Martin-Luther-University Halle-Wittenberg, Physics department

04/1987

PhD in solid state physics, received from Martin-Luther-University Halle-Wittenberg Halle. PhD Thesis on residual stress formation and measurement in glassy material surfaces

09/1986 – 12/1988

Research and Development department, Hermsdorf Ceramics Company

09/1980 – 10/1986

Temporary assistant Professor and scientific aspirant at the Martin-Luther-University Halle-Wittenberg, Department of Physics

09/1975 – 08/1980

Study of physics, Martin-Luther-University Halle-Wittenberg Halle. Diploma Thesis on Strength properties of ion-exchanged glasses

Awards

2019

Best Session Paper at Electronic Components Technology Conference (ECTC) for contribution to the material characterization of advanced cement-based potting systems for efficient power electronics with increased power density, jointly with Bianca Böttge, Falk Naumann and Sandy Klengel

2019

Lifetime Achievement Award at Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration

2018

EUREKA Innovation Award in »Large cooperation SME collaboration« category für research project MASTER_3D, on behalf of Fraunhofer IMWS jointly with Frank Altmann and Sebastian Brand

2018

Best Poster Award at 25th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits for contribution to available and newly developed failure analysis techniques suitable for 3D packaged devices, jointly with Frank Altmann and Sebastian Brand

2013

ENIAC Innovation Award des European Nanoelectronics Forums for »European research project ESiP (EfficientSiliconMulti-Chip System-in-Package Integration)«, jointly with Frank Altmann

2012

Outstanding Paper at 37th International Symposium for Testing and Failure Analysis for »Characterization and failure analysis of TSV interconnects: From non-destructive defect localization to material analysis with nanometer resolution«, jointly with Frank Altmann, Michael Krause and Christian Schmid

2012

Best Session Paper Award at Electronic Components and Technology Conference ECTC for »Characterization and failure analysis of TSV interconnects: From non-destructive defect localization to material analysis with nanometer resolution«, jointly with Frank Altmann, Michael Krause and Christian Schmidt

2009

Second Price for Best Poster at Micromechanics Europe Workshop for »Characterization of reactive nano scale multilayer foils for microsystem applications«, jointly with Bianca Böttge, Nico Teuscher, Jan Schischka, Michael Krause, Susanne Richter, Andreas Heilmann and Jörg Bagdahn

2009

Best Paper Award of Session at International Symposium on Microelectronics of the International Microelectronics Assembly and Packaging Society (IMAPS) for »Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire«, jointly with Robert Klengel, R. Dohle, H. Schulze and F. Rudolf