Fraunhofer Institute for Microstructure of Materials and Systems IMWS
Fraunhofer IMWS is also represented at the International Symposium for Testing and Failure Analysis (ISTFA), the world’s leading conference for failure analysis in electronic components, this year. Frank Altmann, head of the »Semiconductor Technologies Diagnostics« group, hosts the podium discussion on the »Next generation of FA engineer« – the theme of this year’s symposium – during the conference, which takes place from November 6 - 10 in Fort Worth/USA.
He also contributes to the meeting program with a tutorial on »Defect localization by lock-in thermography« and a talk on »Applications of nanoprobing and SEM-based current imaging« as part of a nanoprobing workshop. Altmann, who has been a member of the conference organization team since 2015, also leads the »3D Packages« session. Next year, he will be the »International Chair« of the ISTFA and, in this role, will ensure the distribution of information and recruitment of participants outside the USA.
Michél Simon-Najasek, also from the »Semiconductor Technologies Diagnostics« group at Fraunhofer IMWS, presents new results on ‘Fault Isolation using the EBAC and EBIC Technique’ for the first time as part of a tutorial.