Fraunhofer Institute for Microstructure of Materials and Systems IMWSFrank Altmann is the General Chair of the International Symposium for Testing and Failure Analysis (ISTFA) this year. As General Chair of the ISTFA, the head of the Business Unit "Electronic Materials and Components" at the Fraunhofer Institute for Microstructure of Materials and Systems IMWS in Halle (Saale), together with the organizing team, is setting the content priorities for the conference, which will be held in Phoenix, USA, from November 12 to 16, 2023.
ISTFA is one of the world's most important technical conferences for failure diagnostics in materials science. The five-day conference combines a scientific program with tutorial presentations, networking events and an exhibition. "Every year the conference shows anew how important advanced microscopy methods are for reliable electronics. As Fraunhofer IMWS, we are regularly present there to present new results and to establish contacts. I am very honored to be able to help shape the conference program this time as General Chair and look forward to many exciting contents and encounters," says Altmann.
ISTFA is hosted by ASM International, a professional association in the U.S. for the advancement of materials science and engineering with about 30,000 members worldwide. Topics in focus this year include power electronics with materials such as silicon, silicon carbide and gallium nitride, wide bandgap semiconductors, defect localization, FIB target preparation, nanoprobing or electron microscopy and materials characterization. "These are all topics in which we as Fraunhofer IMWS support our customers. I therefore also see the appointment as General Chair as recognition of our competencies," says Altmann.