With the emerging concepts of mobility and power generation, which are pursued globally, novel materials for semiconductors but also for packaging are required and thus, have visibly moved into the interest of science and industry in the last decade. Especially in power electronics, reliable die attach technologies with high electrical and high thermal performance - as provided for example by Ag sintering - are of major relevance. This talk will discuss an approach for non-destructively assessing the relative porosity in Ag-sinter joints using ultrasonic signals obtained by acoustic microscopy and extended by sophisticated signal analysis employing methods of deep learning.
Speaker: Dr. Sebastian Brand
The expert session is part of our "Materials Insights 20 | 21" series in which we introduce some of the latest highlights of our research focused on current and future needs in industry. Each session provides a 20 minute presentation from one of our experts and (at least) 21 minutes of discussion with the interested parties from industry and science.
Microsoft Teams
September 21, 2021, 13:30-14:15
English