Steps forward to reliable processing of ultra-thin flexible glasses (UTG)

Ultra-thin flexible glass (UTG) substrates with thicknesses lower than 100 µm show excellent surface- and barrier properties comparable to thick glass while being flexible. Therefore, a high potential of UTG is seen in electronical applications e. g. in displays, OLEDS or circuit carriers. Because of the existing challenges (especially the specific material properties like brittle fracture behavior) during handling and processing of UTG, at present, it is only used in special applications.

This talk will give an overview of the general fracture behavior of UTG. Further, challenges to a wide application of UTG are presented together with results from different research activities. In detail, process steps that influence the mechanical toughness of the UTG are discussed with focus on coating and separation methods. Different mechanical test methods are discussed regarding their comparability, advantages and disadvantages.