Sandy Klengel honored for an “Outstanding Paper” at the European Microelectronics and Packaging Conference EMPC

Hochauflösende Analysen für Kupfer nahe IMC (Korrosionsschutz) und Aluminium nahe IMC (nicht angegriffen). — © Fraunhofer IMWS
Results in the paper honored: High-resolution analyses for copper in close contact with IMC (corrosion resistance) and aluminum in close contact with IMC (not attacked).

Palladium und Legierungselement wirken als Hemmstoff — © Fraunhofer IMWS
Palladium and alloy elements function as corrosion inhibitors and help improve the reliability of power electronics.

Sandy Klengel from the Fraunhofer Institute IMWS was honored for an “Outstanding Paper” at the European Microelectronics and Packaging Conference (EMPC) in Pisa. She received the award for her research into the effect of copper wire material on corrosion-resistant packaging and systems for high temperature applications, organized in cooperation with the Nippon Micrometal Corporation in Japan.

The four-day symposium brings together leading international representatives from industry and science to discuss the latest trends in packaging and bonding technologies for microelectronics. It is organized by the International Microelectronics and Packaging Society (IMAPS).

“I am extremely happy to receive this award for my paper and would like to thank in particular Robert Klengel, Jan Schischka and Tino Stephan, who made important contributions to my work. The fact that the jury recognized the importance of our investigations underlines the importance of the microstructural analysis of the materials used in electronics development and the evaluation of reliability”, says Sandy Klengel, who heads the group “Evaluation of electronic system integration” at the Fraunhofer Institute IMWS.

A total of two contributions as “Best Poster” and “Best Paper” were honored at the conference. The international expert jury also selected five works, which received the accolade “Outstanding/Excellent”.