References

Year

Award

Award winner

»Intel Outstanding Researchers Award 2023«

Increasing the sensitivity and 3D resolution of microscopic lock-in thermography analysis, Intel Corporation

»Attendees Best Paper« der ISTFA 2023

Paper »Advances in High-Resolution Non-Destructive Defect Localization based on Machine Learning Enhanced Signal Processing«, presented at the 49th International Symposium for Testing and Failure Analysis (ISTFA)

»Best Poster Award« der internationalen Fachkonferenz CIPS

Poster »Potential failure modes of cement-based encapsulation concepts for reliable power electronics«

Outstanding Paper

Sandy Klengel was awarded for an "Outstanding Paper" by the Fraunhofer IMWS at the European Microelecronics and Packaging Conference (EMPC) in Pisa. She received the award for her research on the influence of copper wire material on corrosion resistant packages and systems for high temperature applications, which took place in cooperation with Nippon Micrometal Corporation in Japan.

2019

Best Session Paper

Bianca Böttge, Falk Naumann, Sandy Klengel and Matthias Petzold, together with other authors, wrote a paper on the material characterization of advanced cement-based sealing systems for efficient power electronics with increased power density, which was awarded as “Best Session Paper” at the Electronic Components Technology Conference (ECTC).

Bianca Böttge, Falk Naumann, Sandy Klengel, Matthias Petzold

2019

Outstanding Interactive Presentation Paper

Sebastian Brand, Bianca Böttge, Michael Kögel, Falk Naumann, Frank Altmann and other authors were awarded at the Electronic Components Technology Conference (ECTC) for their work on the non-destructive assessment of porosity in silver-sintered compounds by means of sound waves.

Sebastian Brand, Bianca Böttge, Michael Kögel, Falk Naumann, Frank Altmann

Best Poster Award

Rico Bernhardt received the Best Poster Award of the 10th International Conference on Integrated Power Electronics Systems (CIPS) for his poster "Novel Specimen Design to Test Engineering Plastics for Power Electronic Applications".

Supplier-Award der Firma Micronas-TDK

Frank Altmann and Michél Simon-Najasek received the Supplier-Award.

Best of Track des International Symposium on Microelectronics

Bianca Böttge was awarded at the International Symposium on Microelectronics in the session Novel Materials/Processes to Bianca Böttge for her contribution to the topic "Reliability of novel ceramic encapsulation materials for electronic packaging".

EUREKA Innovation Award

EUREKA Innovation Award in the category "Large cooperation SME collaboration" to Matthias Petzold, Frank Altmann and Sebastian Brand.

Best Poster Award

Bianca Böttge and Sandy Klengel received the Best Poster Award of the International Conference on Integrated Power Electronics Systems (SIPS) for their contribution to the topic "Novel Specimen Design to Test Engineering Plastics for Power Electronic Applications".

2017

Best Student Paper Award at the 18th International Conference on Electronic Packaging Technology

Frank Altmann, Matthias Petzold and Falk Naumann were awarded at the 8th International Conference on Electronic Packaging Technology for their paper entitled “On reproducing the copper extrusion of through-silicon vias from the autonomic scale”.

Frank Altmann, Matthias Petzold, Falk Naumann

2016

Best Paper 2016 of the ESREF Best Paper Award Committee

Andreas Graff, Michel Simon-Najasek, David Poppitz and Frank Altmann received the Best Paper Award at the 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis for “Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures”.

Andreas Graff, Michél Simon-Najasek, David Poppitz, Frank Altmann

2016

1st prize for one of the Best Posters at ICCG11 - The International Conference on Coatings on Glass and Plastics

Georg Lorenz and Falk Naumann were awarded the 1st prize for one of the Best Posters of the ICCG11 for their poster on the topic of the “Influence of thin-film properties on the reliability of flexible glass”

Georg Lorenz, Falk Naumann

2015

Hugo Junkers Award 2015 of the Ministry of Economics and Science of Saxony-Anhalt for “Fault detection in highly integrated microelectronic systems using lock-in thermography”.

A research team from the Fraunhofer Institute for Microstructure of Materials and Systems IMWS led by Frank Altmann, together with colleagues from the Max Planck Institute of Microstructure Physics, has developed a new thermal imaging technology that is ready for the market, so that electrical defects in memory chips and USB sticks, for example, can be detected quickly and reliably. This work was honored with the Hugo Junkers Award in the category of “Most Innovative Alliance”.

Frank Altmann, Ortwin Breitenstein, Christian Große, Falk Naumann

2014

Outstanding Paper at the 40th International Symposium for Testing and Failure Analysis

Frank Altmann, Jörg Jatzkowski and Michél Simon-Najasek were honored for an outstanding paper on the topic of “Advanced FIB sample preparation techniques for high resolution TEM investigations of HEMT device structures”.

Frank Altmann, Jörg Jatzkowski und Michél Simon-Najasek

2014

Best Paper Award at the imaps-Deutschland fall conference

Falk Naumann was awarded for the best paper with the subject “Mechanical and microstructural
evaluation of semiconductor devices with surface defects”.

Falk Naumann

2014

Best Paper Award ESREF 2014 for paper exchange with ISTFA 2015

Michél Simon-Najasek, Frank Altmann, Susanne Hübner and Andreas Graff were awarded for their paper on the topic of “Advanced FIB sample preparation techniques for high resolution TEM investigations of HEMT device structures” at the European Symposium on Reliability of Electron Devices, Failure Physics and Analysis.

Michél Simon-Najasek, Frank Altmann, Susanne Hübner und Andreas Graff

2014

ECPE Young Engineer Award

Bianca Böttge received the ECPE Young Engineer Award for her paper entitled “High Resolution failure analysis of silver-sintered contact interfaces for power electronics”.

Bianca Böttge

2013

ENIAC Innovation Award 2013 at the European Nanoelectronics Forum

Frank Altmann and Matthias Petzold received the ENIAC Innovation Award for their research project “European research project ESiP (Efficient Silicon Multi-Chip System-in-Package Integration)”.

Frank Altmann und Matthias Petzold

2012

Outstanding Paper at 37th International Symposium for Testing and Failure Analysis

Frank Altmann, Michael Krause, Matthias Petzold and Christian Schmidt received the Best Session Paper Award of the “Electronic Components and Technology Conference ECTC” for their paper, “Characterization and failure analysis of TSV interconnects: From non-destructive defect localization to material analysis with nanometer resolution”.

Frank Altmann, Michael Krause, Matthias Petzold und Christian Schmidt

2012

Best Paper at the Pacific Rim Meeting on Electrochemical and Solid-State Science

Bianca Böttge received the Best Paper Award for her paper, “Failure mechanisms and mechanical characterization of reactive bonded interfaces”.

Bianca Böttge

2012

Sponsorship award of the Halle regional association of the Association of German Engineers

Jörg Jatzkowski received the sponsorship award of the Halle regional association of the Association of German Engineers (VDI) for his master thesis on the “Investigation of contrast mechanisms in the scanning electron microscope for the analysis of doping profiles of integrated circuits”.

Jörg Jatzkowski

2012

Best Session Paper Award at the Electronic Components and Technology Conference ECTC

Frank Altmann, Michael Krause, Matthias Petzold and Christian Schmidt received the Best Session Paper Award of the Electronics and Technology Conference ECTC for their paper concerning the “Characterization and failure analysis of TSV interconnects: From non-destructive defect localization to material analysis with nanometer resolution”.

Frank Altmann, Michael Krause, Matthias Petzold und Christian Schmidt

2009

Second Prize for Best Poster at the Micromechanics Europe Workshop

For their poster with the subject “Characterization of reactive nano scale multilayer foils for microsystem applications”, Bianca Boettge, Nico Teuscher, Jan Schischka, Michael Krause, Susanne Richter, Andreas Heilmann, Matthias Petzold and Jörg Bagdahn were awarded the second prize in the category of Best Poster at the 20th Micromechanics Europe Workshop in Toulouse.

Bianca Boettge, Nico Teuscher, Jan Schischka, Michael Krause, Susanne Richter, Andreas Heilmann, Matthias Petzold, Jörg Bagdahn

2009

Best Paper Award of Session of IMAPS

Matthias Petzold and his research team received the Best Paper Award of Session of IMAPS at the 42nd International Symposium for Microelectronics in San Jose for their paper “Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire”.

Matthias Petzold, Robert Klengel, R. Dohle, H. Schulze, F. Rudolf