Fraunhofer Institute for Microstructure of Materials and Systems IMWSProfile
Sandy Klengel, Group Manager ”Assessment of Electronic Systems Integration“, Deputy Head of Business Unit ”Electronic Materials and Components“
Areas of research
Research into microstructure-property correlations in micro- and power electronic components used in system technology
Reliability analyses and characterization of electronic components at system level
Research on electrochemical corrosion and migration processes in components of packaging and interconnection technology as well as adapted test development
Academic/professional resume
Since 2019
Deputy Head of Business Unit ”Electronic Materials and Components“, Fraunhofer IMWS
Since 2014
Group Manager ”Assessment of Electronic Systems Integration“, Fraunhofer IMWS
2007 - 2014
Deputy Group Manager ”Diagnosis and evaluation of microsystems“, Fraunhofer IMWS
2004 - 2013
Research Associate, Fraunhofer IMWS
1998 - 2004
Studies of electrical engineering with specialization in precision and micro engineering at the Technical University of Dresden
Awards
2019
Outstanding Paper at European Microelecronics and Packaging Conference (EMPC) for research on the influence of copper wire material on corrosion-resistant packages and systems for high-temperature applications, in cooperation with Nippon Micrometal Corporation Japan
2019
Best Session Paper at Electronic Components Technology Conference (ECTC) for paper on the material characterization of advanced cement-based potting systems for efficient power electronics with increased power density, jointly with Bianca Böttge, Falk Naumann and Matthias Petzold
2018
Best Poster Award at International Conference on Integrated Power Electronics Systems (CIPS) for “Novel specimen design to test engineering plastics for power electronic applications”, jointly with Bianca Böttge
Publications
Selected papers in peer-reviewed journals
Klengel, S.; Klengel, R.; Schischka, J.; Stephan, T.; Petzold, M.; Eto, M.; Araki, N.; Yamada, T.
Institute of Electrical and Electronics Engineers -IEEE-; International Microelectronics and Packaging Society -IMAPS-: 22nd European Microelectronics and Packaging Conference & Exhibition, EMPC 2019. Technical papers: 16-19 September 2019, Pisa, Italy. Piscataway, NJ: IEEE, 2019. S. 123-129
Corrosion mechanism in metallization systems for printed circuit boards
Klengel, S.; Stephan, T.; Mühs-Portius, B.; Klengel, R.
TU Dresden, Institut für Aufbau- und Verbindungstechnik der Elektronik -IAVT-; Institute of Electrical and Electronics Engineers -IEEE-; International Microelectronics and Packaging Society -IMAPS-: 7th Electronic System-Integration Technology Conference, ESTC 2018. Proceedings: 18th to 21st Sept. 2018, Dresden, Germany. Piscataway, NJ: IEEE, 2018. S. 268-274
Klengel, S.; Stephan, T.; Spohn, U.
IEEE Components, Packaging, and Manufacturing Technology Society: ECTC 2017, the 67th Electronic Components and Technology Conference: 30 May-2 June 2017, Lake Buena Vista, Florida. Proceedings
Piscataway, NJ: IEEE, 2017. S.1165-1170
High resolution analyzes of resistance behavior in eWLB metal contacts
Klengel, S.; Krause, M.; Berthold, L.; Petzold, M.; Förster, J.; Pressel, K.; Meyer, T.
International Microelectronics and Packaging Society IMAPS: IMAPS 2011, 44th International Symposium on Microelectronics. Proceedings. Vol. 1: Long Beach, California, USA, 9 - 13 October 2011. Red Hook, NY: Curran, 2012. S.241-248